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| MA4SW210B-1 MA4SW310B-1 HMICTM Silicon PIN Diode Switches with Integrated Bias Network Features Broad Bandwidth Specified 2 to 18 GHz Usable up to 26 GHz Integrated Bias Network Low Insertion Loss / High Isolation Rugged, Fully Monolithic Glass Encapsulate Construction Polymer Protective Coating RoHS Compliant MA4SW210B-1 Rev. V4 Description The MA4SW210B-1 and MA4SW310B-1 devices are SP2T and SP3T broad band switches with integrated bias networks utilizing M/A-COM's HMIC TM (Heterolithic Microwave Integrated Circuit) Process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. Large bond pads facilitate the use of low inductance ribbon bonds, while gold backside metallization allows for manual or automatic chip bonding via 80Au/20Sn, Sn62/Pb36/Ag2 solders or electrically conductive silver epoxy. MA4SW310B-1 Parameter Operating Temperature Storage Temperature Junction Temperature Applied Reverse Voltage RF C.W. Incident Power Bias Current +25C Absolute Maximum -65oC to +125oC -65oC to +150oC +175oC - 50V +30dBm C.W. 20mA Max. operating conditions for a combination of RF power, D.C. bias and temperature: +30dBm CW @ 15mA (per diode) @+85C 1 Yellow areas indicate bond pads ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMICTM Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Rev. V4 MA4SW210B-1 (SPDT) Electrical Specifications @ TAMB = +25oC, 20mA Bias current Parameter Frequency 2 GHz 6 GHz 12 GHz 18 GHz 2 GHz Minimum Nominal 1.5 0.70 0.90 1.2 Maximum 1.8 1.0 1.2 1.8 Units dB dB dB dB dB dB dB dB dB dB dB dB ns Insertion Loss 55 47 40 36 60 50 45 40 14 15 15 13.0 50 Isolation 6 GHz 12 GHz 18 GHz 2 GHz Input Return Loss Switching Speed1 6 GHz 12 GHz 18 GHz - MA4SW310B-1 (SP3T) Electrical Specifications @ TAMB = +25oC, 20mA Bias current Parameter Frequency 2 GHz 6 GHz 12 GHz 18 GHz 2 GHz 6 GHz 12 GHz 18 GHz 2 GHz 6 GHz 12 GHz 18 GHz - Minimum Nominal 1.6 0.8 1.0 1.3 59 50 45 40 14 15 16 14 50 Maximum 2.0 1.1 1.3 1.9 Units dB dB dB dB dB dB dB dB dB dB dB dB ns Insertion Loss Isolation 54 47 40 36 Input Return Loss Switching Speed1 Note: 1. Typical switching speed measured from 10% to 90% of detected RF signal driven by TTL compatible drivers using RC output spiking network, R = 50 - 200 , C = 390 - 560pF. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMICTM Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Rev. V4 Typical RF Performance at TAMB = +25C, 20mA Bias Current ISOLATION vs FREQUENCY MA4SW210B-1 0 -10 -20 -30 -40 -50 -60 -70 0 24 6 8 10 12 14 16 18 20 22 24 26 ISOLATION vs FREQUENCY MA4SW310B-1 ISOLATION, dB 0 -10 -20 -30 -40 -50 -60 -70 02 4 6 8 10 12 14 16 18 20 22 24 26 ISOLATION, dB FREQUENCY, GHz FREQUENCY, GHz INSERTION LOSS vs FREQUENCY MA4SW210-B1 INSERTION LOSS, dB INSERTION LOSS, dB 2 0 -2 -4 -6 -8 0 2 4 6 8 10 12 14 16 18 20 22 24 26 INSERTION LOSS vs FREQUENCY MA4SW310B-1 2 0 -2 -4 -6 -8 0 24 6 8 10 12 14 16 18 20 22 24 26 FREQUENCY, GHz FREQUENCY, GHz RETURN LOSS vs FREQUENCY MA4SW210B-1 0 RETURN LOSS vs FREQUENCY MA4SW310B-1 0 -5 -10 -15 -20 -25 -30 -35 -40 024 6 8 10 12 14 16 18 20 22 24 26 RETURN LOSS, dB -10 -15 -20 -25 -30 -35 -40 0 2 4 6 8 10 12 14 16 18 20 22 24 26 RETURN LOSS, dB -5 FREQUENCY, GHz 3 FREQUENCY, GHz ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMICTM Silicon PIN Diode Switches with Integrated Bias Network 140 5 mA RoHS Compliant Rev. V4 MA4SW210B-1 Series Diode Junction Temperature vs. Incident Power at 8 GHz 120 Series Diode_5mA Series Diode_10mA Series Diode_20mA 100 Series Diode_40mA Tjunction ( Deg. C ) 10 mA 80 20 mA 60 40 mA 40 20 10.00 15.00 20.00 25.00 30.00 35.00 C.W. Incident Power ( dBm ) MA4SW210B-1 Compression Power vs. Incident Power at 8 GHz 0.80 0.70 Series Diode_5mA Series Diode_10mA Series Diode_20mA 5 mA 0.60 Series Diode_40mA C pression Pow ( dB ) om er 0.50 10 mA 0.40 20 mA 0.30 40 mA 0.20 0.10 0.00 10.00 15.00 20.00 25.00 30.00 35.00 C.W. Incident Power ( dBm ) Note: The MA4SW310B-1 contains the same PIN diodes and will have similar performance. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMICTM Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Rev. V4 Operation of the MA4SW 210B-1 and MA4SW310B-1 Operation of the MA4SW210B-1 and MA4SW310B-1 PIN diode switches is achieved by simultaneous application of DC currents to the bias pads. The required levels for the different states are shown in the tables below. The control currents should be supplied by constant current sources. The nominal 40 - 60 pull-up resistor voltage @ J4 and J5 is usually -1V for -20mA and +20mA for +1V. Driver Connections MA4SW210B-1 Condition of RF Output J1 - J2 Low Loss Isolation Condition of RF Output J1 - J3 Isolation Low Loss J5 Driver Connections MA4SW310B-1 Control Level IDC @ J6 J7 Condition Condition Condition of of of RF Output RF Output RF Output J1 - J2 Low Loss Isolation Isolation J1 - J3 Isolation Low Loss Isolation J1 - J4 Isolation Isolation Low Loss Control Level IDC @ J4 -20mA +20mA J5 +20mA -20mA -20mA +20mA +20mA +20 mA -20mA +20mA +20mA +20mA -20mA Equivalent Circuit MA4SW210B-1 Equivalent Circuit MA4SW310B-1 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMICTM Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Wire Bonding Thermosonic wedge bonding using 0.003" x 0.00025" ribbon or 0.001" diameter gold wire is recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. If ultrasonic energy is necessary, it should be adjusted to the minimum level required to achieve a good bond. RF bond wires should be kept as short as possible. Chip Mounting The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder preform or conductive epoxy. Mounting surface must be clean and flat. Eutectic Die Attachment: An 80/20, gold-tin, eutectic solder preform is recommended with a work surface temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the temperature at the chip should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 20 seconds. No more than three seconds should be required for attachment. Solders rich in tin should not be used. Epoxy Die Attachment: A minimum amount of epoxy, 1-2 mils thick, should be used to attach chip. A thin epoxy fillet should be visible around the outer perimeter of the chip after placement. Cure epoxy per product instructions. Typically 150C for 1 hour. Rev. V4 MA4SW210B-1 Chip Outline1,2 & Dimensions INCHES DIM A B C D E F G H J K MIN 0.066 0.048 0.004 0.004 0.012 0.029 0.030 0.029 0.005 0.005 MAX 0.070 0.052 0.006 0.006 0.013 0.030 0.031 0.030 REF. REF. MILLIMETERS MIN 1.680 1.230 0.100 0.090 0.292 0.735 0.766 0.732 0.129 0.129 MAX 1.780 1.330 0.150 0.140 0.317 0.760 0.791 0.757 REF. REF. Notes: 1. 6 2. Topside and backside metallization is gold , 2.5m thick typical. Yellow areas indicate wire bonding pads ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMICTM Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Rev. V4 MA4SW310B-1 Chip Outline1,2 & Dimensions INCHES DIM A B C D E F G H J K L M N MIN 0.0697 0.0693 0.0039 0.0310 0.0289 0.0055 0.0035 0.0044 0.0338 0.0632 0.0660 0.0051 0.0046 MAX 0,0736 0.0732 0.0059 0.0319 0.0299 0.0075 0.0055 0.0064 0.0358 0.0652 0.0680 REF. REF. MILLIMETERS MIN 1.770 1.760 0.100 0.787 0.734 0.140 0.089 0.113 0.859 1.610 1.680 0.1290 0.1180 MAX 1.870 1.860 0.150 0.812 0.759 0.190 0.139 0.163 0.909 1.660 1.730 REF. REF. Notes: 1. 2. Topside and backside metallization is gold , 2.5m thick typical. Yellow areas indicate wire bonding pads Ordering Information Part Number MA4SW210B-1 MA4SW310B-1 Package Gel Pack Gel Pack 7 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. |
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